Problems with SMT patch processing production materials will lead to failure to mount normally and low patch processing yield. In order to help everyone avoid these problems, based on our company's many years of patch processing experience, we summarize them as follows.

Common problems with SMT patch processing production materials

1. The absence of marking points and process edges on the PCB board will cause the components on the PCB rail side of the SMT patch machine to fail to stick, and the lack of marking points will lead to low correction accuracy at smaller positions on the PCB board.

2. The SMT components do not correspond to the SMT pads on the PCB board. For example, the SMD pads are too wide or too narrow to match the SMD components.

3. There are past holes on the SMT pads.

4. Components with different directions are not clearly marked.

5. The SMT drawing number or silkscreen drawing number on the PCB board is unclear. For example, when the number of digits is in the middle, it is impossible to confirm the soldering pad to which the number of digits points.

6. There is a conflict between the number of digits of the BOM and the chip diagram at the same position.

7. If the chip resistor accuracy is 1%, please specify it in the BOM table. If not, the default value is 5%.

8. Provide 3-5% spare parts for SMT components for mass production. Sufficient spare parts should be provided for sample making and small batch production. Otherwise, the tail cannot be cleared, and then empty stickers are shipped.